基本資料

• 職稱：助理教授

• 聯絡電話：02-27321104 ext 53310

• 電子郵件：chhuang@mail.ntue.edu.tw

• 研究專長：二維奈米材料與半導體應用，生醫輕金屬與陶瓷鍍層技術，半導體製程與封裝

• 學歷

  國立成功大學工程科學所博士
  國立中山大學材料與光電科學系碩士
  國立高雄師範大學物理系學士

• 經歷

  國立成功大學共研中心營運總監
  中央研究院基因體研究中心博士後研究學者
  國立交通大學光電學院博士後研究員
  台積電六廠製程整合工程師
  台南縣興國中學專任教師

• 授課領域：普通物理學及實驗、電磁學、半導體導論

• 研究室：至善樓614室

期刊論文

1. Chi-Huang Huang, Ray-Wen Wu, and Masahiro Yoshimura. "Improvement of micro/nano-structure and corrosion resistance of TiCu alloy by addition of tin and their Sr-hydroxyapatite coating." Journal of Alloys and Compounds (2024): 173838.  
2. Chi-Huang Huang, and Masahiro Yoshimura. "Biocompatible hydroxyapatite ceramic coating on titanium alloys by electrochemical methods via Growing Integration Layers [GIL] strategy: A review." Ceramics International (2023). 
3. Chi-Huang Huang, and Masahiro Yoshimura. "Direct ceramic coating of calcium phosphate doped with strontium via reactive growing integration layer method on α-Ti alloy." Nature’s Scientific Reports 10.1 (2020): 1-12.    
4. Chi-Huang Huang, Rong-Sheng Chen, Masahiro Yoshimura, “Direct Bioactive Ceramics Coating via Reactive Growing Integration Layer Method on α-Ti-alloy, Materials Science and Engineering: C, 76 (2017): 1216-1223.        
   (Impact Factor: 7.9; Rank Factor: 9/45, Q1) 
5. Chi-Huang Huang, Chin-Hsin Chen , S. Y. Chang, L. C. Tsao, R. S. Chen, “Effect of TiO2 nanoparticle addition and cooling rate on microstructure and mechanical properties of novel Sn1.5Sb0.7Cu solders”, Journal of Materials Science: Materials in Electronics, Volume 26, 2015, Issue 6,pp 3493-3501.
6. .L.C. Tsao, Chi-Huang Huang, C.H. Chung, R.S. Chen, “Influence of TiO2 nanoparticles addition on the microstructural and mechanical properties of Sn0.7Cu nano-composite solder”, Materials Science and Engineering A 545 (2012) 194–200. 
7. R.S. Chen, Chi-Huang Huang and Y.Z. Xie, “Application of Optimal Design on Twin Die Stacked Package by Reliability Indicator of Average SED Concept”, Journal of Mechanics, Volume 28, Issue 01, March 2012,pp135–142. 
8. L. C. Tsao, R. W. Wu, M. W. Wu, Chi-Huang Huang and R. S. Chen, “Formation of ultrafine structure in as cast Ti7CuXSn alloys”, Materials Science and Technology, Volume 29 Issue 12 (December 2013), pp.1529-1536. 
9. R S Chen, H E Cheng, R W Wu, Chi-Huang Huang, W C Liao, and J H Chuang, “Optimal design of thin-profile fine-pitch ball grid array package under drop impact test”, Journal of Mechanical Engineering Science, December 2011 vol.225 no.12,pp.2775-2791.

會議論文

1. .Kent Gillig; Guan-Bo Liao Liao; Da-Shung Su; Chi-Huang Huang; Yuri A. Dyakov; Feng-Wen Jiang; Chung-Hsuan Chen (Academia Sinica, Taipei, Taiwan ),“Portable High Resolution Periodic Focusing Differential Mobility Analyzer”67TH ASMS Conference on Mass Spectrometry and Allied Topics June 2-6, 2019, Atlanta, Georgia.
2. Chi-Huang Huang, Rong-Sheng Chen, and Masahiro Yoshimura,“Preparation and properties of Hydroxyapatite MAO coatings on Ti7Cu5Sn alloy”ISHA2016 5th International Solvothermal and Hydrothermal Association Conference, Jan.17–20, 2016, National Cheng Kung University, Tainan, Taiwan. And“Certificate of Achievement for Best Poster Award”.
3. Rong-Sheng Chen, Chi-Huang Huang, Zi-xuan Huang,“Optimal Design of Dissipation for the Array Power LED by the Genetic Algorithm, Microsystems, Packaging”, Assembly and Circuits Technology Conference (IMPACT),2012 7th International,24-26 Oct.2012,106–109.

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